| Plastic-silicon bonding for MEMS packaging application (CPCI-S收录) | |
| Lou, Xia[1]; Li, Zhihong[2]; Jin, Yufeng[1,2] | |
| 会议名称 | ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2115552 |
| 专题 | 华南理工大学 |
| 作者单位 | 1.[1]Peking Univ, Shenzhen Grad Sch, Shenzhen 518055, Guangdong, Peoples R China 2.[2]Peking Univ, Natl Key Lab Nanoelect Technol, Inst Microelect, Beijing 100871, Peoples R China |
| 推荐引用方式 GB/T 7714 | Lou, Xia[1],Li, Zhihong[2],Jin, Yufeng[1,2]. Plastic-silicon bonding for MEMS packaging application (CPCI-S收录)[C]. 见:ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS. |
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