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	Study on key factors of affecting thermal conductivity of multi-pore ceramic tiles prepared by ceramic polished waste (EI收录)
	Wu, Q.[1,2]; Xie, D.[2]; Xu, Y.[3]
会议名称	Proceedings of the 30th International Thermal Conductivity Conference and the 18th International Thermal Expansion Symposium, Thermal Conductivity 30/Thermal Expansion 18
会议日期	August 29, 2009 - September 2, 2009
会议地点	Pittsburgh, PA, United states
关键词	Building materials Ceramic materials Clay Sintering Sound insulating materials Sound insulation Thermal conductivity Thermal insulation
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2065800
专题	华南理工大学
作者单位	1.[1] Key Laboratory of Special Functional Materials, Ministry of Education, South China University of Technology, Guangzhou 510640, China 2.[2] College of Materials Sci. and Eng., South China University of Technology, Guangzhou 510640, China 3.[3] National Institute for Material Science, Sengen 1-2-1, Tsukuba, Ibaraki 305-0047, Japan
推荐引用方式 GB/T 7714	Wu, Q.[1,2],Xie, D.[2],Xu, Y.[3]. Study on key factors of affecting thermal conductivity of multi-pore ceramic tiles prepared by ceramic polished waste (EI收录)[C]. 见:Proceedings of the 30th International Thermal Conductivity Conference and the 18th International Thermal Expansion Symposium, Thermal Conductivity 30/Thermal Expansion 18. Pittsburgh, PA, United states. August 29, 2009 - September 2, 2009.

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