QQ客服 官方微博 反馈留言

	Optimal design of package structure of the hybrid integrated DC/DC power module based on orthogonal experimental method (EI收录)
	Weng, Jiancheng[1,2]; Liu, Ganggang[3]; He, Xiaoqi[2]; Zhou, Bin[2]; En, Yunfei[2]
会议名称	Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013
会议日期	August 11, 2013 - August 14, 2013
会议地点	Dalian, China
关键词	Electronics packaging Packaging
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2051272
专题	华南理工大学
作者单位	1.[1] School of Material and Energy Resources, Guangdong University of Technology, China 2.[2] Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China 3.[3] School of Mechanical and Electrical Engineering, GUET, Guilin, China
推荐引用方式 GB/T 7714	Weng, Jiancheng[1,2],Liu, Ganggang[3],He, Xiaoqi[2],等. Optimal design of package structure of the hybrid integrated DC/DC power module based on orthogonal experimental method (EI收录)[C]. 见:Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013. Dalian, China. August 11, 2013 - August 14, 2013.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。