| Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al sold (CPCI-S收录) | |
| Lin, Yuan-Jiang[1]; Zhou, Min-Bo[1]; Ma, Xiao[1]; Zhang, Xin-Ping[1] | |
| 关键词 | Aluminum solder paste reflow process soldering parameter reliability |
| URL标识 | 查看原文 |
| 内容类型 | 会议 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2040015 |
| 专题 | 华南理工大学 |
| 推荐引用方式 GB/T 7714 | Lin, Yuan-Jiang[1],Zhou, Min-Bo[1],Ma, Xiao[1],等.Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al sold (CPCI-S收录). |
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