Microporous corrosion behavior of gold-plated printed circuit boards in an atmospheric environment with high salinity

CORC > 宁波材料技术与工程研究所 > 中国科学院宁波材料技术与工程研究所 > 2018专题

	Microporous corrosion behavior of gold-plated printed circuit boards in an atmospheric environment with high salinity
	Li, Xiaogang; Xiong, Ruilin; Hu, Yuting; Wu, Junsheng; Dong, Chaofang; Yi, Pan; Yan, Lidan; Bai, Ziheng; Xiao, Kui
刊名	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
	2018
卷号	29 期号:11 页码:8877-8885
关键词	Electrochemical Migration Raman-spectroscopy Pcb-imag Copper Contamination Temperature Reliability Mechanism Evolution Alloys
英文摘要	The microporous corrosion is the main surface failure mechanism of gold-plated components. The microporous corrosion behavior of electroless nickel and immersion gold (ENIG)-plated printed circuit boards (PCBs) in Turpan area which has an atmospheric environment with high salinity was investigated via a field exposure method for 24 months, as well as 3D analysis, FIB technology, composition analysis, and electrochemical impedance spectroscopy and corrosion mechanism model. After 6 months of exposure, the corrosion products filled up the pores and clustered on the surface as mound shape, and a possible corrosion mechanism model was displayed in the study after 24 months of exposure. The results showed that PCB-ENIG mainly suffered microporous corrosion in a high salinity atmospheric environment. The pores on the gold-plated coating were location where corrosion occurred first and the corrosion products were mostly oxides, chlorides, sulfates and carbonates of copper and nickle.
学科主题	Chemistry ; Electrochemistry ; Energy & Fuels ; Materials Science
语种	英语
公开日期	2018-12-04
内容类型	期刊论文
源URL	[http://ir.nimte.ac.cn/handle/174433/17468]
专题	2018专题
推荐引用方式 GB/T 7714	Li, Xiaogang,Xiong, Ruilin,Hu, Yuting,et al. Microporous corrosion behavior of gold-plated printed circuit boards in an atmospheric environment with high salinity[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(11):8877-8885.
APA	Li, Xiaogang.,Xiong, Ruilin.,Hu, Yuting.,Wu, Junsheng.,Dong, Chaofang.,...&Xiao, Kui.(2018).Microporous corrosion behavior of gold-plated printed circuit boards in an atmospheric environment with high salinity.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,29(11),8877-8885.
MLA	Li, Xiaogang,et al."Microporous corrosion behavior of gold-plated printed circuit boards in an atmospheric environment with high salinity".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 29.11(2018):8877-8885.