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	Surface modification of nano-size SiO2 filler for flip chip underfill applications
	Gang Li; yachuan He; Pengli Zhu; Tao Zhao; Rong Sun; Daniel Lu; Chingping Wong
	2017
会议地点	Harbin
英文摘要	Nano-sized spherical SiO2-filled polymer-based underfill play an important role in improving the reliability of high-density flip-chip packaging [1]. However, SiO2 nanofiller usually suffers from poor dispersion and weak interfacial interaction in nanocomposites due to a huge surface area, which will inevitably result in serious performance deterioration and cause processing difficulty. Firstly, large amount of micro-size SiO2 filler are needed in order to match the thermal expansion coefficient (CTE) of solder balls (25ppm/°C). However, agglomeration phenomenon of nano-size filler will lead a sharp increase in viscosity and the maximum filler loading are decreased. Therefore, how to allow extremely high filler loading while maintaining a low viscosity is one major challenge currently. Secondly, mechanical stress can not be effectively transferred from the matrix to the filler due to weak interfacial interaction, thereby decreasing mechanical strength and toughness. At the same time, the poor mechanical properties will lead to decreased adhesion strength of underfill on various substrates, resulting in serious interface delamination and poor packaging reliability. Finally, the agglomeration phenomenon of nanofiller is prone to phase separation between the filler and the resin, which cause significant differences in flowability and ultimately produces voids during the filling process. Therefore, in order to prepare underfill with desired properties and reliability, it is necessary to solve the poor dispersion and weak interfacial interaction problem of the nano-SiO2 filler in the polymer matrix.
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/11842]
专题	深圳先进技术研究院_集成所
作者单位	2017
推荐引用方式 GB/T 7714	Gang Li,yachuan He,Pengli Zhu,et al. Surface modification of nano-size SiO2 filler for flip chip underfill applications[C]. 见:. Harbin.

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