Comparative studies of the structural and magnetic properties in Cu, Co codoped ZnO multilayer films sputtered on different substrates | |
Liu, H. L.; W. J. Li; J. H. Yang; M. Gao; X. Y. Liu and M. B. Wei | |
刊名 | Journal of Materials Science-Materials in Electronics |
2017 | |
卷号 | 28期号:3 |
英文摘要 | The Zn0.959Cu0.023Co0.018O multilayer films on silicon and polystyrene particles array were prepared using RF magnetron sputtering technique. The influences of the substrate on structural and magnetic properties of Cu, Co codoped ZnO multilayer films were investigated by X-ray diffraction, Scanning electron microscope, X-ray photoelectron spectroscopy, and vibrating sample magnetometer. The results indicated that all the samples were the wurtzite structure with hexagonal shapes of ZnO holding different degree of preferred orientation, the Cu2+, Cu+ and the Co3+, Co2+ ions would uniformly substitute into the Zn2+ sites of ZnO lattice in the samples sputtered on the different substrates. All the samples showed room temperature ferromagnetism, the saturation magnetization and the coercivity of the samples sputtered on the different substrates changed due to the chemical states of the Cu and anisotropy energy of the samples. |
语种 | 英语 |
内容类型 | 期刊论文 |
源URL | [http://ir.ciomp.ac.cn/handle/181722/59067] |
专题 | 长春光学精密机械与物理研究所_中科院长春光机所知识产出 |
推荐引用方式 GB/T 7714 | Liu, H. L.,W. J. Li,J. H. Yang,et al. Comparative studies of the structural and magnetic properties in Cu, Co codoped ZnO multilayer films sputtered on different substrates[J]. Journal of Materials Science-Materials in Electronics,2017,28(3). |
APA | Liu, H. L.,W. J. Li,J. H. Yang,M. Gao,&X. Y. Liu and M. B. Wei.(2017).Comparative studies of the structural and magnetic properties in Cu, Co codoped ZnO multilayer films sputtered on different substrates.Journal of Materials Science-Materials in Electronics,28(3). |
MLA | Liu, H. L.,et al."Comparative studies of the structural and magnetic properties in Cu, Co codoped ZnO multilayer films sputtered on different substrates".Journal of Materials Science-Materials in Electronics 28.3(2017). |
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