Laser cutting sandwich structure glass-silicon-glass wafer with laser induced thermal-crack propagation

CORC > 长春光学精密机械与物理研究所 > 中国科学院长春光学精密机械与物理研究所 > 中科院长春光机所知识产出

	Laser cutting sandwich structure glass-silicon-glass wafer with laser induced thermal-crack propagation
	Cai, Y. C.; M. L. Wang; H. Z. Zhang; L. J. Yang; X. H. Fu and Y. Wang
刊名	Optics and Laser Technology
	2017
卷号	93
英文摘要	Silicon-glass devices are widely used in IC industry, MEMS and solar energy system because of their reliability and simplicity of the manufacturing process. With the trend toward the wafer level chip scale package (WLCSP) technology, the suitable dicing method of silicon-glass bonded structure wafer has become necessary. In this paper, a combined experimental and computational approach is undertaken to investigate the feasibility of cutting the sandwich structure glass-silicon-glass (SGS) wafer with laser induced thermal-crack propagation (LITP) method. A 1064 nm semiconductor laser cutting system with double laser beams which could simultaneously irradiate on the top and bottom of the sandwich structure wafer has been designed. A mathematical model for describing the physical process of the interaction between laser and SGS wafer, which consists of two surface heating sources and two volumetric heating sources, has been established. The temperature stress distribution are simulated by using finite element method (FEM) analysis software ABAQUS. The crack propagation process is analyzed by using the J-integral method. In the FEM model, a stationary planar crack is embedded in the wafer and the J-integral values around the crack front edge are determined using the FEM. A verification experiment under typical parameters is conducted and the crack propagation profile on the fracture surface is examined by the optical microscope and explained from the stress distribution and J-integral value. (C) 2017 Elsevier Ltd. All rights reserved.
语种	英语
内容类型	期刊论文
源URL	[http://ir.ciomp.ac.cn/handle/181722/58829]
专题	长春光学精密机械与物理研究所_中科院长春光机所知识产出
推荐引用方式 GB/T 7714	Cai, Y. C.,M. L. Wang,H. Z. Zhang,et al. Laser cutting sandwich structure glass-silicon-glass wafer with laser induced thermal-crack propagation[J]. Optics and Laser Technology,2017,93.
APA	Cai, Y. C.,M. L. Wang,H. Z. Zhang,L. J. Yang,&X. H. Fu and Y. Wang.(2017).Laser cutting sandwich structure glass-silicon-glass wafer with laser induced thermal-crack propagation.Optics and Laser Technology,93.
MLA	Cai, Y. C.,et al."Laser cutting sandwich structure glass-silicon-glass wafer with laser induced thermal-crack propagation".Optics and Laser Technology 93(2017).