Microscale mechanics for metal thin film delamination along ceramic substrates

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	Microscale mechanics for metal thin film delamination along ceramic substrates
	Wei YG(魏悦广)
刊名	Science in China Series A-Mathematics Physics Astronomy
	2000
卷号	43 期号:5 页码:509-516
ISSN号	1006-9283
通讯作者	Wei, YQ (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
中文摘要	The metal thin film delamination along metal/ceramic interface in the case of large scale yielding is studied by employing the strain gradient plasticity theory and the material microscale effects are considered. Two different fracture process models are used in this study to describe the nonlinear delamination phenomena for metal thin films. A set of experiments have been done on the mechanism of copper films delaminating from silica substrates, based on which the peak interface separation stress and the micro-length scale of material, as well as the dislocation-free zone size are predicted.
学科主题	力学
类目[WOS]	Mathematics, Applied ; Mathematics
研究领域[WOS]	Mathematics
关键词[WOS]	STRAIN GRADIENT PLASTICITY ; CRACK-GROWTH ; TOUGHNESS ; FRACTURE ; SOLIDS ; MODEL
收录类别	SCI
语种	英语
WOS记录号	WOS:000088249100006
公开日期	2007-06-15 ; 2007-12-05 ; 2009-06-23
内容类型	期刊论文
源URL	[http://dspace.imech.ac.cn/handle/311007/17105]
专题	力学研究所_力学所知识产出(1956-2008)
推荐引用方式 GB/T 7714	Wei YG. Microscale mechanics for metal thin film delamination along ceramic substrates[J]. Science in China Series A-Mathematics Physics Astronomy,2000,43(5):509-516.
APA	魏悦广.(2000).Microscale mechanics for metal thin film delamination along ceramic substrates.Science in China Series A-Mathematics Physics Astronomy,43(5),509-516.
MLA	魏悦广."Microscale mechanics for metal thin film delamination along ceramic substrates".Science in China Series A-Mathematics Physics Astronomy 43.5(2000):509-516.