Damage and stress evolution in the bondlines of metallic adhesively bonded joints accompanied by bondline thickness effect
Xu W(徐渭); Yu HC; Tao CH; Xu, W
刊名INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
2015
卷号59页码:86-97
ISSN号0143-7496
DOI10.1016/j.ijadhadh.2015.02.007
文献子类Article
分类号二类
URL标识查看原文
WOS研究方向Engineering ; Materials Science
语种英语
WOS记录号WOS:000353006100011
内容类型期刊论文
源URL[http://dspace.imech.ac.cn/handle/311007/77413]  
专题力学研究所_非线性力学国家重点实验室
通讯作者Xu, W
推荐引用方式
GB/T 7714
Xu W,Yu HC,Tao CH,et al. Damage and stress evolution in the bondlines of metallic adhesively bonded joints accompanied by bondline thickness effect[J]. INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES,2015,59:86-97.
APA 徐渭,Yu HC,Tao CH,&Xu, W.(2015).Damage and stress evolution in the bondlines of metallic adhesively bonded joints accompanied by bondline thickness effect.INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES,59,86-97.
MLA 徐渭,et al."Damage and stress evolution in the bondlines of metallic adhesively bonded joints accompanied by bondline thickness effect".INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES 59(2015):86-97.
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