Study of the Adsorption of Fibrinogen on Gold-Coated Silicon Wafer by an Impedance Method
Yu Y(于泳); Jin G(靳刚)
刊名Journal of Colloid and Interface Science
2003
卷号268页码:288-292
ISSN号0021-9797
通讯作者Jin, G (reprint author), Chinese Acad Sci, Inst Mech, Lab Natl Micrograv, Beijing 100080, Peoples R China.
中文摘要In 0.1 mol/l KH2PO4–Na2HPO4 (pH 7.80) buffer solution, the potential of zero charge (PZC) and the open circuit potential of gold-coated silicon were determined to be about −0.6 and +0.10 V (vs SCE), respectively. The open circuit potential was higher than the PZC, which indicated that the surface of the gold-coated electrode had a positive charge. The ellipsometry experiment showed that the adsorption of fibrinogen onto the gold-coated silicon wafer surface arrived at a saturated state when the adsorption time exceeded 50 min. The percentage of surface without adsorbed protein, θ, was about 63%. This means that the proportion of surface actually occupied by fibrinogen was only about 37% after the adsorption arrived at saturation. The solution/protein capacitance value was determined in an impulse state around −0.59 V (vs SCE) and was stable (4.2×10−5 F) at other potentials.
学科主题力学
类目[WOS]Chemistry, Physical
研究领域[WOS]Chemistry
关键词[WOS]ROTATING-DISK ELECTRODE ; INTERFACIAL BEHAVIOR ; PROTEIN ADSORPTION ; GLOBULAR-PROTEINS ; SOLID-SURFACES ; HUMAN-PLASMA ; ALBUMIN ; MONOLAYERS ; KINETICS ; LAYERS
收录类别SCI
语种英语
WOS记录号WOS:000187019200002
公开日期2007-06-15 ; 2007-12-05 ; 2009-06-23
内容类型期刊论文
源URL[http://dspace.imech.ac.cn/handle/311007/16905]  
专题力学研究所_力学所知识产出(1956-2008)
推荐引用方式
GB/T 7714
Yu Y,Jin G. Study of the Adsorption of Fibrinogen on Gold-Coated Silicon Wafer by an Impedance Method[J]. Journal of Colloid and Interface Science,2003,268:288-292.
APA 于泳,&靳刚.(2003).Study of the Adsorption of Fibrinogen on Gold-Coated Silicon Wafer by an Impedance Method.Journal of Colloid and Interface Science,268,288-292.
MLA 于泳,et al."Study of the Adsorption of Fibrinogen on Gold-Coated Silicon Wafer by an Impedance Method".Journal of Colloid and Interface Science 268(2003):288-292.
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