Thin-film encapsulation of organic electronic devices based on vacuum evaporated lithium fluoride as protective buffer layer

	Thin-film encapsulation of organic electronic devices based on vacuum evaporated lithium fluoride as protective buffer layer
	Peng, YQ; Ding, SH; Wen, ZW; Xu, SN; Lv, WL; Xu, ZQ; Yang, YH; Wang, Y; Wei, Y; Tang, Y
刊名	APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
	2017-03
卷号	123 期号:1-3
ISSN号	0947-8396
通讯作者	Peng, YQ (reprint author), China Jiliang Univ, Coll Opt & Elect Technol, Hangzhou 310018, Zhejiang, Peoples R China. ; Peng, YQ (reprint author), Lanzhou Univ, Inst Microelect, Sch Phys Sci & Technol, Lanzhou 730000, Peoples R China.
学科主题	Materials Science; Physics
出版地	NEW YORK
语种	英语
WOS记录号	WOS:000394314600029
内容类型	期刊论文
源URL	[http://ir.lzu.edu.cn/handle/262010/189325]
专题	物理科学与技术学院_期刊论文
推荐引用方式 GB/T 7714	Peng, YQ,Ding, SH,Wen, ZW,et al. Thin-film encapsulation of organic electronic devices based on vacuum evaporated lithium fluoride as protective buffer layer[J]. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2017,123(1-3).
APA	Peng, YQ.,Ding, SH.,Wen, ZW.,Xu, SN.,Lv, WL.,...&Tang, Y.(2017).Thin-film encapsulation of organic electronic devices based on vacuum evaporated lithium fluoride as protective buffer layer.APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,123(1-3).
MLA	Peng, YQ,et al."Thin-film encapsulation of organic electronic devices based on vacuum evaporated lithium fluoride as protective buffer layer".APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING 123.1-3(2017).