Improving the Thermal Stability of Cu3N Films by Addition of Mn

	Improving the Thermal Stability of Cu3N Films by Addition of Mn
	Fan, XY; Li, ZJ; Meng, A; Li, C; Wu, ZG; Yan, PX
刊名	JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
	2015-08
卷号	31 期号:8 页码:822-827
关键词	Magnetron sputtering Cu3N film Mn-doped Thermal stability
ISSN号	1005-0302
通讯作者	Li, C (reprint author), Ocean Univ China, Dept Phys, Qingdao 266100, Peoples R China.
学科主题	Materials Science; Metallurgy & Metallurgical Engineering
语种	英语
WOS记录号	WOS:000359495200007
内容类型	期刊论文
源URL	[http://ir.lzu.edu.cn/handle/262010/181291]
专题	物理科学与技术学院_期刊论文
推荐引用方式 GB/T 7714	Fan, XY,Li, ZJ,Meng, A,et al. Improving the Thermal Stability of Cu3N Films by Addition of Mn[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2015,31(8):822-827.
APA	Fan, XY,Li, ZJ,Meng, A,Li, C,Wu, ZG,&Yan, PX.(2015).Improving the Thermal Stability of Cu3N Films by Addition of Mn.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,31(8),822-827.
MLA	Fan, XY,et al."Improving the Thermal Stability of Cu3N Films by Addition of Mn".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 31.8(2015):822-827.