| 基于气浮喷射的MEMS封装中通孔的金属互联; Application of Aerosol Jet Technology on Through Hole Metal Interconnection for MEMS Wafer Level Package | |
| 吕文龙 ; 占瞻 ; 虞凌科 ; 杜晓辉 ; 王凌云 ; 孙道恒 | |
| 2014-09-28 | |
| 关键词 | 圆片级封装 气浮沉积 金属互联 欧姆接触 纳米银浆 wafer level package aerosol deposition metal interconnection ohmic contact nano silver |
| 英文摘要 | 在微机电系统(MEMS)圆片级封装中,通孔缺陷极有可能降低芯片与外界电互联的可靠性.采用气浮沉积的方法,在通孔底部沉积纳米银浆,形成低电阻的Ag/Al/SI欧姆接触结构,解决了电极间的电学连接问题.根据AJTM300气溶胶喷射系统的特点,选择50nM粒径的纳米银浆制作通孔Ag/Al/SI欧姆接触结构;在平面圆形Al电极上气浮沉积纳米银浆,改变银浆的烧结温度,用以验证Ag对Al/SI接触电阻的影响;将此法应用于通孔互联结构中,并探究得出最优沉积时间,测量两通孔间的I-V特性.试验结果表明,采用超声雾化方式的气浮沉积方法,在通孔底部沉积15S的纳米银浆,经过300℃的烧结,可以有效填充通孔底部缺陷,并形成较低电阻的Ag/Al/SI接触结构.采用按需喷印的气浮沉积方案对通孔进行沉积,为实现MEMS芯片与外界的电互联提供了新思路.; In MEMS wafer level package,the reliability of electrical interconnection between the chip and external environment may be reduced by the breakage of the through-hole.The breakages of the through-hole deteriorate the reliability of electrical interconnection between internal device and external circuit.In order to solve the problem,the Aerosol Jet technique is adopted in this paper,which deposits nano-silver ink at the bottom of the through hole,forming Ag/Al/Si contact structure with low resistance.First,nanosilver ink with particle diameter of 50 nm is deposited on planar round electrodes with Aerosol Deposition to verify the influence of Ag on Al/Si contact resistance.Then,the bottoms of the through holes are filled with silver ink to form Ag/Al/Si contact structure.The I-Vcharacteristics between two through holes are also tested.The experimental result shows that aerosol jet method with ultrasonic atomizer is able to fill the breakage in through hole and form Ag/Al/Si contact structure with low resistance after depositing nano-silver ink for 15 sand sintering under 300 ℃.The Aerosol Deposition method which is deposit on demand,provides a new thinking to achieve the electrical interconnection.; 国家自然科学基金(51105320) |
| 语种 | zh_CN |
| 内容类型 | 期刊论文 |
| 源URL | [http://dspace.xmu.edu.cn/handle/2288/105800]  |
| 专题 | 航空航天－已发表论文 |
| 推荐引用方式 GB/T 7714 | 吕文龙,占瞻,虞凌科,等. 基于气浮喷射的MEMS封装中通孔的金属互联, Application of Aerosol Jet Technology on Through Hole Metal Interconnection for MEMS Wafer Level Package[J],2014. |
| APA | 吕文龙,占瞻,虞凌科,杜晓辉,王凌云,&孙道恒.(2014).基于气浮喷射的MEMS封装中通孔的金属互联.. |
| MLA | 吕文龙,et al."基于气浮喷射的MEMS封装中通孔的金属互联".(2014). |
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