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	Characteristics of a new non-rosin, lead-free solder paste activity system
	Wang, Cuiping ; Wang, Jian ; Wang, Juan ; Chen, Liang ; Liu, Xingjun ; Wang CP(王翠萍) ; Liu XJ(刘兴军)
	2011
关键词	Characterization Gravimetric analysis Lead compounds Packaging Soldering Thermogravimetric analysis
英文摘要	Conference Name:2011 International Symposium on Advanced Packaging Materials, APM 2011. Conference Address: Xiamen, China. Time:October 25, 2011 - October 28, 2011.; In this work, an activator system used for no-rosin lead-free solder paste was prepared by compounding with 5-Sulposalicylic acid dehydrate and an organic which restrains the over-quick release of the activator. The composition of the active system was studied by thermal gravimetric analysis. Additional, characterizations of the solder paste with various formula such as viscosity, wettability and shelf life have been evaluated. The solder paste performs the best wettability, the lowest residue, and improved shelf life when the weight percentage of 5-Sulposalicylic acid dehydrate to activity control agent is 20 to 47 in the activity system. ? 2011 IEEE.
语种	英语
出处	http://dx.doi.org/10.1109/ISAPM.2011.6105710
出版者	IEEE Computer Society
内容类型	其他
源URL	[http://dspace.xmu.edu.cn/handle/2288/85157]
专题	材料学院－会议论文
推荐引用方式 GB/T 7714	Wang, Cuiping,Wang, Jian,Wang, Juan,et al. Characteristics of a new non-rosin, lead-free solder paste activity system. 2011-01-01.

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