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	A novel bulk micromachined tunneling gyroscope
	Wang, Lingy ; Su, Yuanzhe ; Lei, Y ; Li, Wenwang ; Liu, Yifan ; Sun, Daohen ; Wang LY(王凌云) ; Liu YF(刘益芳) ; Sun DH(孙道恒)
	2011
关键词	Atmospheric pressure Electron tunneling Glass Glass bonding Modal analysis Natural frequencies Reactive ion etching Semiconducting silicon compounds Silicon wafers Wafer bonding
英文摘要	Conference Name:6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2011. Conference Address: Kaohsiung, Taiwan. Time:February 20, 2011 - February 23, 2011.; Institute of Electrical and Electronics Engineers (IEEE); IEEE Nanotechnology Council (NTC); National Cheng Kung University; National Tsing Hua University; Chinese International NEMS Socity (CINS); A bulk micromachined vibratory tunneling gyroscope, which employs the high displacement sensitivity of quantum tunneling to obtain the desired resolution and is fabricated with silicon-glass wafer bonding and DRIE (Deep Reactive Ion Etching), has been developed. The device structure consists of a proof mass which can oscillate due to electrostatic comb driving and an out-of-plane silicon frame linked up to substrate by suspended springs. Because of adopting the silicon frame structure to get larger proof mass and putting tunneling tip at the end of silicon frame to obtain remarkable deformation induced by Coriolis force, the new ultracompact devices can provide extremely high sensitivity and wide dynamic range. Based on the modal analysis of gyroscope by FEM method, the structure dimensions are optimized according to resonant frequency matching of driving mode and detection mode. Simulation results demonstrate that the gyroscope owns the sensitivity of 0.7 A(°/sec) at atmospheric pressure. The deep dry silicon on glass (DDSOG) process has been successfully used to fabricate this bulk tunneling gyroscope. The tunneling current is observed at deflection voltage 45.7V. The exponential relationship between tunneling current and square deflection voltage verifies the tunneling effect mechanism between the tip and the detected electrode. ? 2011 IEEE.
语种	英语
出处	http://dx.doi.org/10.1109/NEMS.2011.6017492
出版者	IEEE Computer Society
内容类型	其他
源URL	[http://dspace.xmu.edu.cn/handle/2288/86362]
专题	物理技术－会议论文
推荐引用方式 GB/T 7714	Wang, Lingy,Su, Yuanzhe,Lei, Y,et al. A novel bulk micromachined tunneling gyroscope. 2011-01-01.

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