Experimental study of thermal plasma processing waste circuit boards | |
Wang, Songb ; Cheng, Changming ; Lan, Wei ; Zhang, Xianhui ; Liu, Dongping ; Yang, Size ; Zhang XH(张先徽) ; Liu DP(刘东平) ; Yang SZ(杨思泽) | |
2013 | |
关键词 | Copper Electric power supplies to apparatus Energy resources Organic pollutants Petroleum deposits Power electronics Refuse incinerators Slags Waste incineration |
英文摘要 | Conference Name:2012 3rd International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2012. Conference Address: Beihai, China. Time:December 22, 2012 - December 23, 2012.; University of Wollongong, Australia; Northeastern University, China; University of Science and Technology Beijing; Hong Kong Industrial Technology Research Centre; This study aimed to that waste circuit boards in batches were incinerated by thermal plasma. Firstly, the working principle of plasma incinerator and the exhaust gas treatment main process were introduced, then, the experimental results was analyzed and discussed. Due to the thermal plasma processing waste incineration furnace has high temperature (1200 0C above), all the organic ingredients in waste circuit boards, including dioxin, can be decomposed completely in a few milliseconds, no showing the secondary pollution and no producing furans and other carcinogens. In addition, after main exhaust gas (CO, NO) concentration change with time was carefully tracked, it was found that a large amount of CO gas was produced and NO gas concentration was within national safety limits during experiment. Although 44.4 kg sample was incinerated, more than 1 kg of small pieces of metal like Copper was obtained from the cooling molten slag. Finally, it was obvious that the volume and weight of molten slag was far less than the ones of sample. The experimental result has important practical significance for protecting the environment, obtaining more CO gas resource and retrieving a variety of rare metals (such as Gold, Copper, Silver, Platinum, etc.). ? (2013) Trans Tech Publications, Switzerland. |
语种 | 英语 |
出处 | http://dx.doi.org/10.4028/www.scientific.net/AMR.652-654.1553 |
出版者 | Trans Tech Publications |
内容类型 | 其他 |
源URL | [http://dspace.xmu.edu.cn/handle/2288/86116] |
专题 | 物理技术-会议论文 |
推荐引用方式 GB/T 7714 | Wang, Songb,Cheng, Changming,Lan, Wei,et al. Experimental study of thermal plasma processing waste circuit boards. 2013-01-01. |
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