Electrohydrodynamic direct - Writing of conductor - Insulator-conductor multi-layer interconnection

CORC > 厦门大学 > 物理技术－已发表论文

	Electrohydrodynamic direct - Writing of conductor - Insulator-conductor multi-layer interconnection
	Zheng, Gao-Feng ; Pei, Yan-B ; Wang, Xiang ; Zheng, Jian-Yi ; Sun, Dao-Heng ; Zheng GF(郑高峰) ; Zheng JY(郑建毅) ; Sun DH(孙道恒)
刊名	http://dx.doi.org/10.1088/1674-1056/23/6/066102
	2014
关键词	Printing Silver Thermoelectric equipment
英文摘要	A multi-layer interconnection structure is a basic component of electronic devices, and printing of the multi-layer interconnection structure is the key process in printed electronics. In this work, electrohydrodynamic direct-writing (EDW) is utilized to print the conductor - insulator - conductor multi-layer interconnection structure. Silver ink is chosen to print the conductor pattern, and a polyvinylpyrrolidone (PVP) solution is utilized to fabricate the insulator layer between the bottom and top conductor patterns. The influences of EDW process parameters on the line width of the printed conductor and insulator patterns are studied systematically. The obtained results show that the line width of the printed structure increases with the increase of the flow rate, but decreases with the increase of applied voltage and PVP content in the solution. The average resistivity values of the bottom and top silver conductor tracks are determined to be 1.34 × 10-7 Ω·m and 1.39 × 10-7 Ω·m, respectively. The printed PVP layer between the two conductor tracks is well insulated, which can meet the insulation requirement of the electronic devices. This study offers an alternative, fast, and cost-effective method of fabricating conductor - insulator - conductor multi-layer interconnections in the electronic industry. ? 2014 Chinese Physical Society and IOP Publishing Ltd.
语种	英语
出版者	IOP PUBLISHING LTD
内容类型	期刊论文
源URL	[http://dspace.xmu.edu.cn/handle/2288/92200]
专题	物理技术－已发表论文
推荐引用方式 GB/T 7714	Zheng, Gao-Feng,Pei, Yan-B,Wang, Xiang,et al. Electrohydrodynamic direct - Writing of conductor - Insulator-conductor multi-layer interconnection[J]. http://dx.doi.org/10.1088/1674-1056/23/6/066102,2014.
APA	Zheng, Gao-Feng.,Pei, Yan-B.,Wang, Xiang.,Zheng, Jian-Yi.,Sun, Dao-Heng.,...&孙道恒.(2014).Electrohydrodynamic direct - Writing of conductor - Insulator-conductor multi-layer interconnection.http://dx.doi.org/10.1088/1674-1056/23/6/066102.
MLA	Zheng, Gao-Feng,et al."Electrohydrodynamic direct - Writing of conductor - Insulator-conductor multi-layer interconnection".http://dx.doi.org/10.1088/1674-1056/23/6/066102 (2014).