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	Comparison of residual stress measurement in thin films using surface micromachining method
	He, Q. ; Luo, Z. X. ; Chen, X. Y. ; He Q(何琼)
	2008-06-30
关键词	STRAIN POLYSILICON
英文摘要	Conference Name:3rd International Conference on Advances of Thin Films and Coatings. Conference Address: Singapore, SINGAPORE. Time:DEC 11-15, 2006.; Conductive, dielectric, semiconducting, piezoelectric and ferroelectric thin films are extensively used for MEMS/NEMS applications. One of the important parameters of thin films is residual stress. The residual stress can seriously affect the properties, performance and long-term stability of the films. Excessive compressive or tensile stress results in buckling, cracking, splintering and sticking problems. Stress measurement techniques are therefore essential for both process development and process monitoring. Many suggestions for stress measurement in thin films have been made over the past several decades. This paper is concentrated on the in situ stress measurement using surface micromachining techniques to determine the residual stress. The authors review and compare several types of stress measurement methods including buckling technique, rotating technique, micro strain gauge and long-sbort beam strain sensor. (C) 2007 Elsevier B.V. All rights reserved.
语种	英语
出处	http://dx.doi.org/10.1016/j.tsf.2007.07.086
出版者	THIN SOLID FILMS
内容类型	其他
源URL	[http://dspace.xmu.edu.cn/handle/2288/85604]
专题	经济学院－会议论文
推荐引用方式 GB/T 7714	He, Q.,Luo, Z. X.,Chen, X. Y.,et al. Comparison of residual stress measurement in thin films using surface micromachining method. 2008-06-30.

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