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	微孔挤压技术制备SiC_w补强CMAS玻璃陶瓷基复合材料; PREPARATION of SiC w REINFORCED CMAS GLASS_CERAMIC MATRIX COMPOSITE BY MICRO_HOLE EXTRUSION TECHNIQUE
	高桂英 ; 陈立富
	1999
关键词	碳化硅晶须 玻璃陶瓷 微孔挤压 silicon carbide whisker glass_ceramic micro_hole extrusion
英文摘要	通过微孔挤压技术成功地制备了含有SICW补强的钙-镁-铝的硅酸盐（CMAS）玻璃陶瓷基复合材料.SICW加入到已球磨好的CMAS粉末与有机添加剂的浆料中，得到SICW分散均匀的混合浆料.含有机添加剂仅为7%左右的浆料就可在较低的压力下（2.37kPA）挤压通过微孔（＝250μM），获得SICW分散均匀并高度取向的纤维状生坯.晶须高度取向补强增加了CMAS的强度，含晶须10%的CMAS通过无压烧结可以制备出高致密度的复合材料.; SiC w reinforced CMAS glass_ceramic composite was fabricated successfully by micro_hole extrusion technique.The mixture of PAN, DMF and CMAS was homogenized by ball_milling, SiC w was immersed into DMF and ultrasonically dispersed in a separate container, then SiC w was filtered out and the cake was added into the powder slurry.Stirring for 60 min was adequate to produce a homogeneous paste.The paste was wet_spun using a laboratory spinning apparatus.Continuous fiber will be easily extruded at a low extrusion pressure (2.37 kPa)through a small orifice (250 μm).Only normal sintering gives a nearly, fully dense glass_ceramic composite.The oriented whisker in the glass_ceramic matrix increases the strength of the material remarkably.; 福建省自然科学基金
语种	zh_CN
内容类型	期刊论文
源URL	[http://dspace.xmu.edu.cn/handle/2288/98540]
专题	材料学院－已发表论文
推荐引用方式 GB/T 7714	高桂英,陈立富. 微孔挤压技术制备SiC_w补强CMAS玻璃陶瓷基复合材料, PREPARATION of SiC w REINFORCED CMAS GLASS_CERAMIC MATRIX COMPOSITE BY MICRO_HOLE EXTRUSION TECHNIQUE[J],1999.
APA	高桂英,&陈立富.(1999).微孔挤压技术制备SiC_w补强CMAS玻璃陶瓷基复合材料..
MLA	高桂英,et al."微孔挤压技术制备SiC_w补强CMAS玻璃陶瓷基复合材料".(1999).

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