Development of materials design tool and its application in Pb-free micro-solders in electronic package

CORC > 厦门大学 > 材料学院－已发表论文

	Development of materials design tool and its application in Pb-free micro-solders in electronic package
	Liu, X. J. ; Wang, C. P. ; Ohnuma, I. ; Chen, S. L. ; Kainuma, R. ; Ishida, K. ; Chang, A. Y. ; Wang CP(王翠萍)
刊名	http://dx.doi.org/10.1007/s11431-010-3199-x
	2010-06
关键词	THERMODYNAMIC CALCULATION PHASE-EQUILIBRIA SURFACE-TENSION TERNARY-SYSTEM LIQUID ALLOYS DIAGRAM SOLIDIFICATION SIMULATION SB
英文摘要	National Natural Science Foundation of China [50425101]; Ministry of Science and Technology, P. R. China [2009DFA52170]; National High-Tech Research and Development Program of China ("863" Project) [2009AA03Z101]; Ministry of Education, P. R. China [70703; A materials design tool for developing Pb-free soldering alloys in electronic package was developed based on comprehensive experimental data of phase equilibria and thermodynamic properties data accumulated with the CALPHAD (calculation of phase diagrams) method and contains 10 elements, namely, Ag, Au, Bi, Cu, In, Ni, Sb, Sn, Zn and Pb. It can handle the calculation of phase diagrams in all combinations of these elements and all composition ranges. In addition, based on this tool, the liquidus, solidus, phase fractions and constitutions, equilibrium and non-equilibrium solidification behavior, surface tension and viscosity of liquid, diffusion reactions and microstructural evolution, etc. can be predicted. Typical examples of the calculation and application of this tool are presented. The design tool is expected to be a powerful tool for the development of Pb-free solders, as well as for promoting the understanding of the interfacial phenomena between Cu substrate and Pb-free solders in electronic packaging technology.
语种	英语
内容类型	期刊论文
源URL	[http://dspace.xmu.edu.cn/handle/2288/59766]
专题	材料学院－已发表论文
推荐引用方式 GB/T 7714	Liu, X. J.,Wang, C. P.,Ohnuma, I.,et al. Development of materials design tool and its application in Pb-free micro-solders in electronic package[J]. http://dx.doi.org/10.1007/s11431-010-3199-x,2010.
APA	Liu, X. J..,Wang, C. P..,Ohnuma, I..,Chen, S. L..,Kainuma, R..,...&王翠萍.(2010).Development of materials design tool and its application in Pb-free micro-solders in electronic package.http://dx.doi.org/10.1007/s11431-010-3199-x.
MLA	Liu, X. J.,et al."Development of materials design tool and its application in Pb-free micro-solders in electronic package".http://dx.doi.org/10.1007/s11431-010-3199-x (2010).