Design of Pb-free solders in electronic packaging by computational thermodynamics and kinetics

CORC > 厦门大学 > 材料学院－已发表论文

	Design of Pb-free solders in electronic packaging by computational thermodynamics and kinetics
	Liu XJ(刘兴军) ; OHNUMA Ikuo ; KAINUMA Ryosuke ; ISHIDA Kiyohito
刊名	http://epub.cnki.net/grid2008/brief/detailj.aspx?filename=HUJI200502020&dbname=CJFQ2005
	2005-06-25
关键词	Pb-free solders thermodynamic database thermodynamic calculation computational kinetics
英文摘要	Computational thermodynamics and kinetics were used to design the Pb-free micro-solders for replacing the conventional Sn-Pb solders because of the health and environmental safety problem. On the basis of CALPHAD (Calculation of Phase Diagrams) method we can easily calculate properties such as the liquidus projection, isothermal and vertical sectional diagrams and phase fraction in multi-component system including Ag, Bi, Cu, In, Sb, Sn, Zn and Pb elements. In addition, other related information such as the surface tension, viscosity of the liquid phase and solidification simulation can also be obtained. DICTRA (Diffusion Controlled Transformation) software was used to simulate the interfacial reactions between substrate and Pb-free solders, which can easily give the information on the growth of intermetallic compounds and moving speed of interface between substrate and solders etc.
语种	中文
内容类型	期刊论文
源URL	[http://dspace.xmu.edu.cn/handle/2288/55331]
专题	材料学院－已发表论文
推荐引用方式 GB/T 7714	Liu XJ,OHNUMA Ikuo,KAINUMA Ryosuke,et al. Design of Pb-free solders in electronic packaging by computational thermodynamics and kinetics[J]. http://epub.cnki.net/grid2008/brief/detailj.aspx?filename=HUJI200502020&dbname=CJFQ2005,2005.
APA	刘兴军,OHNUMA Ikuo,KAINUMA Ryosuke,&ISHIDA Kiyohito.(2005).Design of Pb-free solders in electronic packaging by computational thermodynamics and kinetics.http://epub.cnki.net/grid2008/brief/detailj.aspx?filename=HUJI200502020&dbname=CJFQ2005.
MLA	刘兴军,et al."Design of Pb-free solders in electronic packaging by computational thermodynamics and kinetics".http://epub.cnki.net/grid2008/brief/detailj.aspx?filename=HUJI200502020&dbname=CJFQ2005 (2005).