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	硅微振梁式加速度计抗温漂的微结构及工艺设计
	王帆 ; 董景新 ; 赵淑明 ; 严斌 ; WANG Fan ; DONG Jing-xin ; ZHAO Shu-ming ; YAN Bin
	2016-03-30 ; 2016-03-30
关键词	硅微振梁式加速度计 温度漂移 抗温漂耦合设计 半粘结封装 MEMS resonant accelerometer temperature drift silicon-glass coupling method half-bonding decoupling method TH824.4
其他题名	Temperature insensitive design of MEMS resonant accelerometer
中文摘要	针对硅微振梁式加速度计输出频率随环境温度漂移的问题,提出了抗温漂的硅微结构设计方法及相关工艺,降低了环境温度对输出的影响,在室温条件即可达到一定精度。通过建立"硅-玻璃"和"玻璃-陶瓷"耦合模型,分析了造成硅微振梁式加速度计温度漂移的原因。然后提出了"抗温漂耦合设计"的微结构和"半粘结封装"的封装工艺,降低了耦合模型中的理论温漂。利用加工出的原理样机进行实验,结果显示,采用抗温漂结构设计及封装工艺的原理样机,输出频率的温漂系数为-3.5×10-6/℃,室温下零偏稳定性为72.0μg。实验验证了抗温漂理论的可行性,可以满足室温下高精度硅微振梁式加速度计的设计要求。; In view that MEMS resonant accelerometers have output frequency drifts which are varied with ambient temperature, a MEMS's structure design and processing technology are proposed to reduce the impact of ambient temperature and guarantees the high performance of MEMS resonant accelerometers at room temperature. Firstly, based on a "silicon-glass" and "glass-ceramic" coupling model, the main sources that cause the temperature effects are analyzed. Then, "Silicon-Glass Coupling Method" and "Half-Bonding Decoupling Method" are proposed to reduce the temperature effect in the coupling models. Finally, a principle prototype based on the theory is used to implement experiments, and the experiment results show that the temperature coefficient of natural frequency is-3.5×10-6/℃, and the bias stability is 72.0 ?g at room temperature. The experiments verify that the proposed temperature-insensitive design is feasible and satisfies the requirements of high-performance MEMS resonant accelerometers at room temperature.
语种	中文 ; 中文
内容类型	期刊论文
源URL	[http://ir.lib.tsinghua.edu.cn/ir/item.do?handle=123456789/144546]
专题	清华大学
推荐引用方式 GB/T 7714	王帆,董景新,赵淑明,等. 硅微振梁式加速度计抗温漂的微结构及工艺设计[J],2016, 2016.
APA	王帆.,董景新.,赵淑明.,严斌.,WANG Fan.,...&YAN Bin.(2016).硅微振梁式加速度计抗温漂的微结构及工艺设计..
MLA	王帆,et al."硅微振梁式加速度计抗温漂的微结构及工艺设计".(2016).

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