| 声子气的黏度 | |
| 叶振强 ; 董源 ; 曹炳阳 ; 过增元 ; YE Zhen-Qiang ; DONG Yuan ; CAO Bing-Yang ; GUO Zeng-Yuan | |
| 2016-03-30 ; 2016-03-30 | |
| 关键词 | 声子气黏度 热质理论 声子气扩散系数 声子态密度 O643.1 |
| 其他题名 | Study on Viscosity of Phonon Gas |
| 中文摘要 | 声子是介电固体中导热过程的主要载体,研究声子的黏性对正确预测纳米材料中的非傅里叶导热等现象有着重要意义.本文从热质理论出发,基于涨落耗散理论导出了声子气黏度的表达式:ηh=hv/3πλα,其中ηh表示声子气的黏度,v_a为声子平均频率,λ为声子波长,α为材料热扩散系数。预测了单晶硅在300 K时的声子气黏度,其参考值为4.8×10~(-9)Pa·s。并且与基于声子水动力学模型和气体动理论模型的声子气黏度结果进行比较,发现本文模型的结果比声子水动力学模型的结果大2个量级,而比动理论模型小5个量级。; Phonons are main energy carriers for heat conduction in dielectric materials.The viscosity of phonon gas is a key quantity to understand the non-Fourier heat conduction in nanomaterials.From the perspective of the thermomass theory,the viscosity of phonon gas is derived as η_h=hυ/3πλαbased on the fluctuation dissipation theorem,in which η_h is the viscosity of phonon gas,υ_a is the phonon average frequency,λ is the phonon wave length and α is the thermal diffusivity.The viscosity of phonon gas of sihcon at 300 K is predicted as 4.8×10~(-9) Pa·s.Moreover,we compare our results with those based on phonon hydrodynamics and kinetic theory.The result of this model is two orders larger than that from the phonon hydrodynamics,but five orders smaller than that from the kinetic theory. |
| 语种 | 中文 ; 中文 |
| 内容类型 | 期刊论文 |
| 源URL | [http://ir.lib.tsinghua.edu.cn/ir/item.do?handle=123456789/143820]  |
| 专题 | 清华大学 |
| 推荐引用方式 GB/T 7714 | 叶振强,董源,曹炳阳,等. 声子气的黏度[J],2016, 2016. |
| APA | 叶振强.,董源.,曹炳阳.,过增元.,YE Zhen-Qiang.,...&GUO Zeng-Yuan.(2016).声子气的黏度.. |
| MLA | 叶振强,et al."声子气的黏度".(2016). |
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