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	Prediction of size effect on thermal conductivity of nanoscale metallic films
	Feng, Bo ; Li, Zhixin ; Zhang, Xing
	2010-10-12 ; 2010-10-12
关键词	Size effect Thermal conductivity Nanoscale metallic film Grain boundary scattering ELECTRICAL-RESISTIVITY MODEL POLYCRYSTALLINE FILMS EXTERNAL SURFACES THIN-FILMS RELIABILITY TECHNOLOGY REFLECTION RESISTANCE WIRES Materials Science, Multidisciplinary Materials Science, Coatings & Films Physics, Applied Physics, Condensed Matter
中文摘要	Incorporating both the scattering mechanisms of the rough film surfaces and the microscopic grain boundaries, we report on a realistic simulation of the in-plane thermal conductivity of nanoscale gold, copper and aluminum films on the basis of non-interacting electron and kinetic theory. The results are consistent with previous theoretical analyses and molecular dynamic simulations, as well as available experimental data. The thermal conductivity of metallic films is found to drop much below the bulk value, even showing dielectric effects. As with the size effect on the electrical conductivity of metallic films, the fine-grain structure has a greater effect on the thermal conductivity than the film surface properties. The influence of temperature on the thermal conductivity is also investigated. Crown Copyright (C) 2008 Published by Elsevier B.V. All rights reserved.
语种	英语 ; 英语
出版者	ELSEVIER SCIENCE SA ; LAUSANNE ; PO BOX 564, 1001 LAUSANNE, SWITZERLAND
内容类型	期刊论文
源URL	[http://hdl.handle.net/123456789/79044]
专题	清华大学
推荐引用方式 GB/T 7714	Feng, Bo,Li, Zhixin,Zhang, Xing. Prediction of size effect on thermal conductivity of nanoscale metallic films[J],2010, 2010.
APA	Feng, Bo,Li, Zhixin,&Zhang, Xing.(2010).Prediction of size effect on thermal conductivity of nanoscale metallic films..
MLA	Feng, Bo,et al."Prediction of size effect on thermal conductivity of nanoscale metallic films".(2010).

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