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	Study on thermal shock resistance of insulated metal substrate
	Guo Liquan ; Liu Yang ; Ma Jusheng
	2010-05-10 ; 2010-05-10
关键词	Experimental/ aluminium anodisation ball grid arrays electrical resistivity metallic thin films surface treatment thermal resistance thermal shock/ thermal shock resistance insulated metal substrate anodizing processes surface temperature Al substrate anodic film electrical resistivity breakdown voltage room temperature BGA packaging 10/sup 13/ ohmcm 293 to 298 K 300 degC Al/ A8160B Surface treatment and degradation of metals and alloys A7220F Low-field transport and mobility piezoresistance (semiconductors/insulators) A7360H Electrical properties of insulators (thin films/low-dimensional structures) B0170J Product packaging/ resistivity 1.0E+11 ohmm temperature 2.93E+02 to 2.98E+02 K temperature 5.73E+02 K/ Al/sur Al/el
中文摘要	Anodizing technique was applied to prepare insulated metal substrates (IMS) for BGA packaging. "Ideal" IMS used anodic film of aluminum as the insulating layer instead of epoxy, which led to higher thermal conductivity. However, the thermal shock resistance of IMS is poor because of the great difference of thermal expansion coefficient between aluminum and its anodic film. In this study, different anodizing processes of aluminum were analyzed. The parameters, which can affect the thermal shock resistance of IMS, especially the surface temperature of Al substrate, were studied. The anodic film obtained with the optimized parameters of anodizing process had excellent performance, such as the resistivity was over 10/sup 13/ Omega middot cm, the breakdown voltage was higher than 600 V, and the most important thing was that it could resist thermal shocks between room temperature and 300 degrees C. Then BGA packaging was successfully performed based on this IMS.
语种	英语 ; 英语
出版者	Trans Tech Publications ; Switzerland
内容类型	期刊论文
源URL	[http://hdl.handle.net/123456789/20277]
专题	清华大学
推荐引用方式 GB/T 7714	Guo Liquan,Liu Yang,Ma Jusheng. Study on thermal shock resistance of insulated metal substrate[J],2010, 2010.
APA	Guo Liquan,Liu Yang,&Ma Jusheng.(2010).Study on thermal shock resistance of insulated metal substrate..
MLA	Guo Liquan,et al."Study on thermal shock resistance of insulated metal substrate".(2010).

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