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	Efficient diffusion bonding between BSCCO superconducting multifilamentary tapes
	Zou, Guisheng ; Wang, Yanjun ; Wu, Aiping ; Bai, Hailin ; Hu, Naijun ; Song, Xiuhua ; Yi, Hanping
	2010-05-10 ; 2010-05-10
会议名称	ADVANCED WELDING AND MICRO JOINING / PACKAGING FOR THE 21ST CENTURY ; International Welding/Joining Conference-Korea (IWJC-Korea 2007) ; Seoul, SOUTH KOREA ; Web of Science
关键词	Bi-Sr-Ca-Cu-O tapes diffusion bonding superconducting electrical properties JOINT WIRE Materials Science, Multidisciplinary
中文摘要	To improve the joining efficiency of Bi-Sr-Ca-Cu-O (BSCCO) superconducting tapes., a new diffusion bonding technology with a direct uniaxial pressing at high temperature was developed to join 61-filament tapes. It was observed that bonding parameters such as bonding pressure and holding time, significantly affected the critical current ratio (CCRo). A peak CCRo value of 89 % for the lap-joined tapes was achieved at 3 MPa for 2 It when bonding temperature was 800 degrees C. Compared with the conventional diffusion bonding technology, this new technology remarkably shortened the fabrication period and improved the superconductivity of the joints. The bonding interface and microstructures of the joints were evaluated and correlated to the CCRo. Ail uniaxial pressing at high temperature was beneficial to interface bonding, and there was an optimal pressure value for the CCRo.
会议录出版者	TRANS TECH PUBLICATIONS LTD ; STAFA-ZURICH ; LAUBLSRUTISTR 24, CH-8717 STAFA-ZURICH, SWITZERLAND
语种	英语 ; 英语
内容类型	会议论文
源URL	[http://hdl.handle.net/123456789/19030]
专题	清华大学
推荐引用方式 GB/T 7714	Zou, Guisheng,Wang, Yanjun,Wu, Aiping,et al. Efficient diffusion bonding between BSCCO superconducting multifilamentary tapes[C]. 见:ADVANCED WELDING AND MICRO JOINING / PACKAGING FOR THE 21ST CENTURY, International Welding/Joining Conference-Korea (IWJC-Korea 2007), Seoul, SOUTH KOREA, Web of Science.

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