Normally OFF GaN-on-Si MIS-HEMTs Fabricated With LPCVD-SiNx Passivation and High-Temperature Gate Recess | |
Shi, YJ; Huang, S; Bao, QL; Wang, XH; Wei, K; Jiang, HJ; Li, JF; Zhao, C; Li, SM; Zhou, Y(周宇) | |
刊名 | IEEE TRANSACTIONS ON ELECTRON DEVICES |
2016 | |
卷号 | 63期号:2 |
英文摘要 | Low-current-collapse normally OFF GaN-on-Si MIS high-electron-mobility transistors (MIS-HEMTs) are fabricated with low-pressure chemical-vapor-deposited SiNx (LPCVD-SiNx) passivation and high-temperature low-damage gate-recess technique. The high-thermal-stability LPCVD-SiNx enables a passivation-prior-to-ohmic process strategy and effectively suppresses deep states at the passivation/HEMT interface. The fabricated MIS-HEMTs feature a high V-TH of +0.85 V at the drain current of 1 mu A/mm and a remarkable ON/OFF current ratio of 10(10) while reduced dynamic ON-resistance as compared to plasma-enhanced chemical-vapor-deposited SiO2 passivation. High field-effect channel mobility of 180 cm(2)/V . s is achieved, leading to a high maximum drain current density of 663 mA/mm. |
关键词[WOS] | HIGH-THRESHOLD VOLTAGE ; ENHANCEMENT-MODE ; ALGAN/GAN HEMT ; TRANSISTORS ; RESISTANCE ; INTERFACE ; METAL |
收录类别 | SCI |
语种 | 英语 |
WOS记录号 | WOS:000369304700013 |
内容类型 | 期刊论文 |
源URL | [http://ir.sinano.ac.cn/handle/332007/4721] |
专题 | 苏州纳米技术与纳米仿生研究所_纳米器件及相关材料研究部_孙钱团队 |
推荐引用方式 GB/T 7714 | Shi, YJ,Huang, S,Bao, QL,et al. Normally OFF GaN-on-Si MIS-HEMTs Fabricated With LPCVD-SiNx Passivation and High-Temperature Gate Recess[J]. IEEE TRANSACTIONS ON ELECTRON DEVICES,2016,63(2). |
APA | Shi, YJ.,Huang, S.,Bao, QL.,Wang, XH.,Wei, K.,...&Liu, XY.(2016).Normally OFF GaN-on-Si MIS-HEMTs Fabricated With LPCVD-SiNx Passivation and High-Temperature Gate Recess.IEEE TRANSACTIONS ON ELECTRON DEVICES,63(2). |
MLA | Shi, YJ,et al."Normally OFF GaN-on-Si MIS-HEMTs Fabricated With LPCVD-SiNx Passivation and High-Temperature Gate Recess".IEEE TRANSACTIONS ON ELECTRON DEVICES 63.2(2016). |
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