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	3D graphene foam and carbon fibers reinforced epoxy resin composites with enhanced thermal conductivity
	Sheng-Yun Huang; Yaqiang Ji; Haoran Wen; Kai Zhang; Matthew M.F. Yuen; Xian-Zhu Fu; Rong Sun; C.P. Wong
	2016
会议名称	China Semiconductor Technology International Conference 2016, CSTIC 2016
会议地点	Shanghai, China
英文摘要	Graphene foam (GF), carbon fibers (CFs) and GF/CFs reinforced epoxy resin composites were fabricated and their thermal properties were investigated. Due to continuous interconnected structures of GF and avoiding the CFs aggregation in epoxy resin, GF/CFs reinforced epoxy resin demonstrates greatly higher thermal conductivity than the single GF or CFs reinforced epoxy, which could provide a strong candidate for highly thermal conductive polymer composites.
收录类别	EI
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/10101]
专题	深圳先进技术研究院_集成所
作者单位	2016
推荐引用方式 GB/T 7714	Sheng-Yun Huang,Yaqiang Ji,Haoran Wen,et al. 3D graphene foam and carbon fibers reinforced epoxy resin composites with enhanced thermal conductivity[C]. 见:China Semiconductor Technology International Conference 2016, CSTIC 2016. Shanghai, China.

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