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	Thermal property analysis of boron nitride-filled glass-fiber reinforced polymer composites
	Zhang, Jingyu; Zeng, Xiaoliang; Sun, Rong; Xu, Jian-Bin
	2014
会议名称	Proceedings of the Electronic Packaging Technology Conference, EPTC,
会议地点	中国
英文摘要	Glass fibers-reinforced BT resins composites (GFRBT) filled with the hexagonal boron nitride (h-BN) ranging from 20 to 80 wt% were prepared. The effect of BN content on the thermal conductivity and thermal stability of GFRBT was invesitigated. When weight fractions were no more than 60 wt%, the formation of BN network was contributed to the thermal conductivity, which showed an increasing with the increase of BN loadings. The thermal conductivity increased to 1.60 W/m.k when GFRBT filled by 60 wt% BN. However, further increasing of BN loadings led to a decreased thermal conductivity due to the increasing voids, defects and deteriorating film quality. The thermal degradation results indicated the initial decomposing temperatures and the maximum decomposition point shifted to higher temperature, which rose to 339 °C and 420 °C when GFRBT filled by 60 wt%, indicating that the thermal stability of GFRBT composites was enhanced by the addition of BN. GFRBT filled by BN with high thermal conductivity and excellent thermal stability should be taken into account the potential applications in the advanced packaging.
收录类别	EI
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/5639]
专题	深圳先进技术研究院_集成所
作者单位	2014
推荐引用方式 GB/T 7714	Zhang, Jingyu,Zeng, Xiaoliang,Sun, Rong,et al. Thermal property analysis of boron nitride-filled glass-fiber reinforced polymer composites[C]. 见:Proceedings of the Electronic Packaging Technology Conference, EPTC,. 中国.

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