Ultra-low-kappa HFPDB-based periodic mesoporous organosilica film with high mechanical strength for interlayer dielectric

	Ultra-low-kappa HFPDB-based periodic mesoporous organosilica film with high mechanical strength for interlayer dielectric
	Jiawei Zhang; Guoping Zhang; Yongju Gao; Rong Sun; C. P. Wong
刊名	Journal of Materials Science
	2016
英文摘要	A novel bridged organosilane precursor with star-shaped construction, [hexfluoropropane-2,2-diyl)dibenzyl-bridged organosilane (HFPDBO)], is prepared by facile organic synthesis method. The resultant HFPDBO precursor is mixed with porogen and acid catalyst to prepare periodic mesoporous organosilica (PMO) thin film via evaporation-induced self-assembly after spin-coating procedure. All the as-prepared HFPDB-based PMO thin film has been characterized by Fourier transform infrared spectroscopy, nuclear magnetic resonance spectrum, scanning electron microscopy, transmission electron microscope, and small-angle X-ray diffraction, respectively. Thereinto, the HFPDB-based PMO thin film with weight ratio of porogen to precursor (0.75:1) possesses excellent dielectric property (1.58@1 MHz of dielectric constants), high mechanical property (5.54 ± 0.11 GPa of Young’s modulus) and hydrophobic property (90.1° of water contact angle) simultaneously. These low dielectric constant, high mechanical strength, and the hydrophobicity suggest potential application of the HFPDB-based PMO thin films as low-k materials in microelectronics.
收录类别	SCI
原文出处	http://link.springer.com/article/10.1007/s10853-016-0066-6
语种	英语
内容类型	期刊论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/9874]
专题	深圳先进技术研究院_集成所
作者单位	Journal of Materials Science
推荐引用方式 GB/T 7714	Jiawei Zhang,Guoping Zhang,Yongju Gao,et al. Ultra-low-kappa HFPDB-based periodic mesoporous organosilica film with high mechanical strength for interlayer dielectric[J]. Journal of Materials Science,2016.
APA	Jiawei Zhang,Guoping Zhang,Yongju Gao,Rong Sun,&C. P. Wong.(2016).Ultra-low-kappa HFPDB-based periodic mesoporous organosilica film with high mechanical strength for interlayer dielectric.Journal of Materials Science.
MLA	Jiawei Zhang,et al."Ultra-low-kappa HFPDB-based periodic mesoporous organosilica film with high mechanical strength for interlayer dielectric".Journal of Materials Science (2016).