Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations

CORC > 力学研究所 > 中国科学院力学研究所 > 非线性力学国家重点实验室

	Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations
	Yang XS; Wang YJ; Zhai HR; Wang GY; Su YJ; Dai LH(戴兰宏); Ogata S; Zhang TY
刊名	JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS
	2016
通讯作者邮箱	zhangty@shu.edu.cn
卷号	94 页码:191-206
关键词	Creep Nanotwin Activation parameters HRTEM Atomistic simulations
ISSN号	0022-5096
通讯作者	Zhang, TY (reprint author), Shanghai Univ, Shanghai Univ Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China. ; Zhang, TY (reprint author), Shanghai Univ, Shanghai Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China.
产权排序	[Yang, Xu-Sheng; Zhang, Tong-Yi] Shanghai Univ, Shanghai Univ Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China; [Yang, Xu-Sheng; Zhang, Tong-Yi] Shanghai Univ, Shanghai Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China; [Wang, Yun-Jiang; Dai, L. H.] Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China; [Yang, Xu-Sheng; Zhai, Hui-Ru] Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Kowloon, Hong Kong, Peoples R China; [Wang, Guo-Yong] Jilin Univ, Dept Mat Sci & Engn, Key Lab Automobile Mat, 5988 Renmin St, Changchun 130025, Peoples R China; [Su, Yan-Jing] Univ Sci & Technol Beijing, Key Lab Environm Fracture MOE, Ctr Corros & Protect, Beijing 100083, Peoples R China; [Ogata, Shigenobu] Osaka Univ, Grad Sch Engn Sci, Dept Mech Sci & Bioengn, Osaka 5608531, Japan; [Ogata, Shigenobu] Kyoto Univ, Elements Strategy Initiat Struct Mat, Kyoto 6068501, Japan
中文摘要	In the present work, we performed experiments, atomistic simulations, and high-resolution electron microscopy (HREM) to study the creep behaviors of the nanotwinned (nt) and nanograined (ng) copper at temperatures of 22 degrees C (RT), 40 degrees C, 50 degrees C, 60 degrees C, and 70 degrees C. The experimental data at various temperatures and different sustained stress levels provide sufficient information, which allows one to extract the deformation parameters reliably. The determined activation parameters and microscopic observations indicate transition of creep mechanisms with variation in stress level in the nt-Cu, i.e., from the Coble creep to the twin boundary (TB) migration and eventually to the perfect dislocation nucleation and activities. The experimental and simulation results imply that nanotwinfling could be an effective approach to enhance the creep resistance of twin-free ng-Cu. The experimental creep results further verify the newly developed formula (Yang et al., 2016) that describes the time-, stress-, and temperature-dependent plastic deformation in polycrystalline copper. (C) 2016 Elsevier Ltd. All rights reserved.
分类号	一类
类目[WOS]	Materials Science, Multidisciplinary ; Mechanics ; Physics, Condensed Matter
研究领域[WOS]	Materials Science ; Mechanics ; Physics
关键词[WOS]	Creep ; Nanotwin ; Activation parameters ; HRTEM ; Atomistic simulations
收录类别	SCI ; EI
原文出处	http://dx.doi.org/10.1016/j.jmps.2016.04.021
语种	英语
WOS记录号	WOS:000382342300012
内容类型	期刊论文
源URL	[http://dspace.imech.ac.cn/handle/311007/59744]
专题	力学研究所_非线性力学国家重点实验室
推荐引用方式 GB/T 7714	Yang XS,Wang YJ,Zhai HR,et al. Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations[J]. JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS,2016,94:191-206.
APA	Yang XS.,Wang YJ.,Zhai HR.,Wang GY.,Su YJ.,...&Zhang TY.(2016).Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations.JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS,94,191-206.
MLA	Yang XS,et al."Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations".JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS 94(2016):191-206.