Stepwise work hardening induced by individual grain boundary in Cu bicrystal micropillars

CORC > 金属研究所 > 中国科学院金属研究所

	Stepwise work hardening induced by individual grain boundary in Cu bicrystal micropillars
	Li, L. L. ; Zhang, Z. J. ; Tan, J. ; Jiang, C. B. ; Qu, R. T. ; Zhang, P. ; Yang, J. B. ; Zhang, Z. F.
刊名	SCIENTIFIC REPORTS
	2015
卷号	5 页码:-
ISSN号	2045-2322
通讯作者	zhfzhang@imr.ac.cn
收录类别	SCI
资助信息	National Natural Science Foundation of China (NSFC) [51171194, 51331007, 51471170]; IMR SYNL-T.S. Ke Research Fellowship
语种	英语
公开日期	2016-04-21
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/75131]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	Li, L. L.,Zhang, Z. J.,Tan, J.,et al. Stepwise work hardening induced by individual grain boundary in Cu bicrystal micropillars[J]. SCIENTIFIC REPORTS,2015,5:-.
APA	Li, L. L..,Zhang, Z. J..,Tan, J..,Jiang, C. B..,Qu, R. T..,...&Zhang, Z. F..(2015).Stepwise work hardening induced by individual grain boundary in Cu bicrystal micropillars.SCIENTIFIC REPORTS,5,-.
MLA	Li, L. L.,et al."Stepwise work hardening induced by individual grain boundary in Cu bicrystal micropillars".SCIENTIFIC REPORTS 5(2015):-.